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Fusing Resistor - RF10-100

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保險絲電阻

SINLOON® 繞線塗裝絕緣保險絲電阻 更多 RF10-100
Power Rated: 1/2W ~ 1W WIRE WOUND FUSES RESISTOR
Fusing Resistor - FR10
EATURES 有圖
有圖
The Fusible resistor is applied to safety circuit in wide range of electronic sets.
Complete flame proof construction resistance range 0.12R ~ 75R ohm
Resistance tolerance : ±5%; ±10%/
There are 4 color band is in white color means wire wound fusible resistor

保險絲與電阻其材質及結構上有類似之特性,而保險絲電阻兼備二者之功能,設置於電路中可當一般電阻使用,一旦電流異常時,發揮其保險絲特性保護產品電路不致全部受損。
由於保險絲特性有二用的功能,故在設計電路時,很多工程師都會使用保險絲電阻放置於電路中,大大降低成本。本公司所生產之貼片保險絲產品,為貼片型表面封裝,適用於平面化及小型化之產品類別,功率分別由1/4W ~ 1W,價格比市面所使用的玻璃封裝和繞線保險絲電阻體積更小,成本更底,具有價格上的優勢。

Color code

The fusing time 30/sec Max.
NTRODUCTION
RF10 Type (Standard)
Rated power : 1/4W ; 1/2W; 1W.
Superior quality fusible resistors which are flameproof during operation
These resistors fuse in less than 30 seconds at 16 times rated power
XTERNAL DIMENSIONS
Type Power DIMENSION (mm)
L ΦD H Φd
RF10-100 1W 10±0.5 3.0±0.5 25±2 0.56±0.03 Reference Standard
40±2 IEC 60115-1/JISC 520-1/UL 1412.
FUSING CHARACTERISTICS
Type Power Resistance Tolerance Magnification of Power Rating Fusing TCR Dielectric
Rating Range Time (ppm/) withstanding
RF10-100 1W 0.22Ω~100Ω ±5% X15 X20 X25 30S ±250 >600V
Rated Ambient Temperature: 70.
Operating Temperature Range: -40 ~ +155
Rated Continuous Working Voltage: RCWV= P*R   (Rated Continuous Working Voltage = Power * Resistance Ω )
The above power rating and fusing time for standard fusible resistors,  other spec. on request
Remark: The products value range for standard resistance, below or over this resistance on request please contact us.
using Resistor – RF10 Series
There are some similarities between resistor and fuses in material and structure, Fusing Resistor contain both function,
as being resistor in normal condition and changed into fuse while abnormal current comes in to product machine and
equipment. Since two functions performed by resistor, the cost therefore saved.
Our RF10 Fusing Resistor series are produced with precision technique, enabling precise fusing time and stabilized
aiming to reach best quality resistors.
最近更新在 週四, 17 三月 2016 09:16  
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Newsflash

LED 芯片封裝技術
產品應用 LED 芯片封裝技術
基板芯片封裝工藝技術有兩種形式: 一種是板上芯片封裝(COB)技術,它採用了絲焊的
方法在硅片和基底之間用引線直接建立電極連接,並用樹脂覆蓋保護以确保它的可靠性。
但它的封裝密度遠不及倒片焊封裝技術。
- 另一種是倒裝芯片(FLIP CHIP)技術,一種無引腳錶面封裝結構,一般含有電路單元,
設計用於通過適當數量的位於其面上的錫球,在電氣上和機械上連接於電路,然後將芯片
翻轉加熱利用熔接的錫鉛球與基板結合,此封裝熔接技術替換了常規打線連接電極的方法
- ,將漸會是未來的LED芯片封裝主流。
COB相比, FLIP CHIP封裝形式的芯片結構和輸入/(I/O)(焊鍚球)方向朝下,
原於I/O引端分佈於整個芯片錶面,故在封裝密度和處理速度上 FLIP CHIP 己達最佳效果
- ,特別是它可以採用SMT技術的手段來加工,因此是LED芯片封裝技術及高蜜度安裝的最
終使用方法。FLIP CHIP 封裝技術與傳統的COB的引線結合工藝相比具有許多明顯的
優點,包括優越的電學及熱學性能,高I/O引腳數,封裝尺寸更小。